Patent Assignment
Reel/Frame 021659/0829
Assignment of Assignor's Interest
Recorded: 2008-10-09
Pages: 4
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU,, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device Having Cleaning of the Semiconductor Devices Including a via Hole
Application:
12/248,450 →
Publication:
US 2009/0137118
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.