IP Library › Assignment 021729/0463
Patent Assignment
Reel/Frame 021729/0463

Assignment of Assignor's Interest

Recorded: 2008-10-21 Pages: 7
Assignors
RUBY, RICHARD C.
Executed: 2008-10-20
ROLAND, JAMES P.
Executed: 2008-10-20
GEEFAY, FRANK S.
Executed: 2008-10-14
Assignee
AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property (1)
Bonded Wafer Structure and Method of Fabrication
Patent: 8,102,044 →
Application: 12/254,536 →
Publication: US 2010/0096745
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0703 →