IP Library › Assignment 021735/0171
Patent Assignment
Reel/Frame 021735/0171

Assignment of Assignor's Interest

Recorded: 2008-10-24 Pages: 2
Assignors
OZONO, MITSURU
Executed: 2007-04-18
SAKAI, TADAHIKO
Executed: 2007-04-18
EIFUKU, HIDEKI
Executed: 2007-04-19
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Electronic Component Soldering Structure and Electronic Component Soldering Method
Patent: 8,148,253 →
Application: 11/816,558 →
Publication: US 2009/0075025
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021818/0725 →