Patent Assignment
Reel/Frame 021739/0094
Assignment of Assignor's Interest
Recorded: 2008-10-27
Pages: 3
Assignors
OKUYA, TAMAO
Executed: 2008-09-17
ARUGA, HIROSHI
Executed: 2008-09-17
HIGUCHI, YOSHIAKI
Executed: 2008-09-17
Assignee
ASAHI GLASS COMPANY, LIMITED
12-1, YURAKUCHO 1-CHOME, CHIYODA-KU, TOKYO, 100-8405, JAPAN
Covered Property
(1)
Release Film for Semiconductor Resin Molds
Application:
12/258,520 →
Publication:
US 2009/0053528
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.