IP Library › Assignment 021766/0780
Patent Assignment
Reel/Frame 021766/0780

Assignment of Assignor's Interest

Recorded: 2008-10-31 Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2008-10-30
CHOU, CHIU-MING
Executed: 2008-10-30
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property (1)
Structure of Gold Bumps and Gold Conductors on One Ic Die and Methods of Manufacturing the Structures
Patent: 8,581,404 →
Application: 12/262,195 →
Publication: US 2009/0057894
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →