IP Library Assignment 021797/0075
Patent Assignment
Reel/Frame 021797/0075

Assignment of Assignor's Interest

Recorded: 2008-11-06 Pages: 3
Assignor
SASAOKA, KENJI
Executed: 2008-10-16
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, KAGO-CHO 1-CHOME, ICHIGAYA, SHINJUKU-KU, TOKYO, 162-0062, JAPAN
Covered Property (1)
Wiring Board with a Built-in Component and Method for Manufacturing the Same
Patent: 8,737,085 →
Application: 12/299,861 →
Publication: US 2009/0107715