IP Library Assignment 021798/0352
Patent Assignment
Reel/Frame 021798/0352

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2008-11-06 Received: 2008-11-06 Pages: 5
Assignors
CHOW, SENG GUAN
Executed: 2008-10-31
KUAN, HEAP HOE
Executed: 2008-10-31
SHIM, IL KWON
Executed: 2008-10-31
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
EMBEDDED SEMICONDUCTOR DIE PACKAGE AND METHOD OF MAKING THE SAME USING METAL FRAME CARRIER
App. No. 12/266,313