Patent Assignment
Reel/Frame 021850/0952
Assignment of Assignor's Interest
Recorded: 2008-11-18
Pages: 4
Assignors
HANEDA, MASAKI
Executed: 2008-09-30
SUNAYAMA, MICHIE
Executed: 2008-10-08
SHIMIZU, NORIYOSHI
Executed: 2008-10-08
OHTSUKA, NOBUYUKI
Executed: 2008-10-01
NAKAO, YOSHIYUKI
Executed: 2008-09-30
TABIRA, TAKAHIRO
Executed: 2008-09-30
Assignee
FUJITSU MICROELECTRONICS LIMITED
7-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, 163-0722, JAPAN
Covered Property
(1)
Method of Manufacturing a Multilayer Interconnection Structure in a Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.