Patent Assignment
Reel/Frame 021857/0503
Assignment of Assignor's Interest
Recorded: 2008-10-31
Pages: 5
Assignors
YANG, DONG-JU
Executed: 2008-10-24
CHOI, SHIN-IL
Executed: 2008-10-24
KIM, SANG-GAB
Executed: 2008-10-24
OH, MIN-SEOK
Executed: 2008-10-24
CHIN, HONG-KEE
Executed: 2008-10-24
LEE, KI-YEUP
Executed: 2008-10-24
JEONG, YU-GWANG
Executed: 2008-10-24
CHOI, SEUNG-HA
Executed: 2008-10-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Wiring Layer and Method of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.