IP Library › Assignment 021888/0088
Patent Assignment
Reel/Frame 021888/0088

Assignment of Assignor's Interest

Recorded: 2008-11-25 Pages: 5
Assignors
MURAMATSU, SHUICHI
Executed: 2008-10-23
SUZUKI, HIDETOSHI
Executed: 2008-10-28
SATO, TOMOYUKI
Executed: 2008-10-23
Assignee
KOKUSAN DENKI CO., LTD.
3744 OHKA, NUMAZU-SHI, SHIZUOKA, 410-0022, JAPAN
Covered Property (1)
Resin Sealing Semiconductor Device and Electronic Device Using Resin Sealing Semiconductor Device
Patent: 7,868,451 →
Application: 12/302,376 →
Publication: US 2009/0201651
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 19, 2022
From: KOKUSAN DENKI CO., LTD.
To: MAHLE ELECTRIC DRIVES JAPAN CORPORATION
Reel/Frame 061235/0084 →
Nunc Pro Tunc Assignment Nov 3, 2022
From: MAHLE ELECTRIC DRIVES JAPAN CORPORATION
To: MAHLE INTERNATIONAL GMBH
Reel/Frame 061648/0601 →