Patent Assignment
Reel/Frame 021894/0173
Assignment of Assignor's Interest
Recorded: 2008-11-26
Pages: 3
Assignor
SUGIZAKI, YOSHIAKI
Executed: 2008-09-22
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Method for Manufacturing an Electronic Component Package and Electronic Component Package