Patent Assignment
Reel/Frame 021894/0372
Assignment of Assignor's Interest
Recorded: 2008-11-26
Pages: 8
Assignors
CHOUNG, JONG-HYUN
Executed: 2008-06-20
PARK, HONG-SICK
Executed: 2008-06-20
HONG, SUN-YOUNG
Executed: 2008-06-20
KIM, BONG-KYUN
Executed: 2008-06-20
LEE, BYEONG-JIN
Executed: 2008-06-20
KIM, BYUNG-UK
Executed: 2008-11-14
JEONG, JONG-HYUN
Executed: 2008-11-14
YOON, SUK-IL
Executed: 2008-11-14
SHIN, SUNG-GUN
Executed: 2008-11-14
HUH, SOON-BEOM
Executed: 2008-11-14
JUNG, SE-HWAN
Executed: 2008-11-14
JANG, DOO-YOUNG
Executed: 2008-11-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Composition for Removing Photoresist and Method of Manufacturing an Array Substrate Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.