IP Library › Assignment 021946/0429
Patent Assignment
Reel/Frame 021946/0429

Assignment of Assignor's Interest

Recorded: 2008-12-09 Pages: 2
Assignors
SIRINORAKUL, SARAVUTH
Executed: 2008-12-08
KONGTHAWORN, KASEMSAN
Executed: 2008-12-08
Assignee
UNITED TEST AND ASSEMBLY CENTER, LTD.
5 SERANGOON NORTH AVENUE 5, SINGAPORE, 554916, SINGAPORE
Covered Property (1)
Flip-Chip Leadframe Semiconductor Package
Patent: 8,816,482 →
Application: 12/330,681 →
Publication: US 2009/0146276
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment. Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →