IP Library Assignment 021968/0447
Patent Assignment
Reel/Frame 021968/0447

Assignment of Assignor's Interest

Recorded: 2008-12-10 Pages: 5
Assignors
PAYNE, JASON J.
Executed: 2003-06-23
GAILUS, MARK W.
Executed: 2003-06-23
KHILCHENKO, LEON M.
Executed: 2003-06-23
REN, HUILIN
Executed: 2003-06-23
Assignee
TERADYNE, INC.
321 HARRISON AVENUE, BOSTON, MASSACHUSETTS, 02118
Covered Property (1)
Printed Circuit Board for High Speed, High Density Electrical Connector with Improved Cross-Talk Minimization, Attenuation and Impedance Mismatch Characteristics
Patent: 7,508,681 →
Application: 11/808,642 →
Publication: US 2008/0030970
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 10, 2008
From: TERADYNE, INC.
To: AMPHENOL CORPORATION
Reel/Frame 021968/0467 →
Release of Security Interest May 24, 2019
From: EAST WEST BANK
To: MAXWELL TECHNOLOGIES, INC.
Reel/Frame 051441/0005 →