Patent Assignment
Reel/Frame 022031/0411
Assignment of Assignor's Interest
Recorded: 2008-12-26
Pages: 2
Assignors
ARAHATA, TORU
Executed: 2008-12-18
ISHII, SHINOBU
Executed: 2008-12-18
FUJISAWA, HIROMI
Executed: 2008-12-18
Assignee
KAIJO CORPORATION
3-1-5 SAKAE-CHO, HAMURA-CITY, TOKYO, JAPAN
Covered Property
(1)
Wire Bonding Method, Wire Bonding Apparatus, and Wire Bonding Control Program