Patent Assignment
Reel/Frame 022047/0039
Assignment of Assignor's Interest
Recorded: 2008-12-31
Received: 2008-12-31
Pages: 6
Assignors
CHIN, HONG-KEE
Executed: 2008-12-17
CHOI, SEUNG-HA
Executed: 2008-12-17
CHOI, SHIN-IL
Executed: 2008-12-17
JANG, JAE-HO
Executed: 2008-12-17
JEONG, YU-GWANG
Executed: 2008-12-17
KIM, SANG-GAB
Executed: 2008-12-17
LEE, KI-YEUP
Executed: 2008-12-17
OH, MIN-SEOK
Executed: 2008-12-17
YANG, DONG-JU
Executed: 2008-12-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, KRX, KOREA, REPUBLIC OF
Covered Properties
(2)
Substrate Support, Substrate Processing Apparatus Including Substrate Support, and Method of Aligning Substrate
Application:
12/347,779 →
Methods and Systems for Improving Communication Throughput of Storage Links
Application:
12/347,783 →