Patent Assignment
Reel/Frame 022062/0044
Corrective Assignment to Correct the Assignors Doc Dates Previously Recorded on Reel 009067 Frame 0055. Assignor(S) Hereby Confirms the Assignors' Doc Dates Should Be Corrected as Follows: 12/09/1997; 12/03/1997; 12/02/1997; 12/03/1997 and 12/02/1997.
Recorded: 2009-01-06
Pages: 5
Assignors
WANG, TSUNG-HSIUNG
Executed: 1997-12-09
CHEN, MAN-LIN
Executed: 1997-12-03
CHIOU, CHUANG-SHIN
Executed: 1997-12-02
CHAN, MING-SHUN
Executed: 1997-12-03
DING, PEI-WEN
Executed: 1997-12-02
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING ROAD, CHUTUNG TOWN, HSINCHU HSIEN, TAIWAN
Covered Property
(1)
Method for Manufacturing High-Density Multilayer Printed Circuit Boards
Patent:
6,119,338 →
Application:
09/044,969 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 2, 2008
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: TRANSPACIFIC IP 1 LTD.,
Reel/Frame 021901/0870 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 021901 Frame 0870. Assignor(S) Hereby Confirms the Assignee Name Is "Transpacific Ip I Ltd." Not "Transpacific Ip 1 Ltd.,".
Jun 10, 2011
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: TRANSPACIFIC IP I LTD.
Reel/Frame 026428/0496 →