Patent Assignment
Reel/Frame 022083/0767
Assignment of Assignor's Interest
Recorded: 2009-01-09
Pages: 5
Assignors
NAMIE, YUUJI
Executed: 2008-11-04
KONNO, TOMOHISA
Executed: 2008-11-10
MOTONARI, MASAYUKI
Executed: 2008-11-07
SHIDA, HIROTAKA
Executed: 2008-11-10
TAKEMURA, AKIHIRO
Executed: 2008-11-11
Assignee
JSR CORPORATION
6-10, TSUKIJI 5-CHOME, CHUO-KU, TOKYO, 104-8410, JAPAN
Covered Property
(1)
Chemical Mechanical Polishing Aqueous Dispersion and Chemical Mechanical Polishing Method for Semiconductor Device