Merger

Recorded: 2009-01-14 Received: 2009-01-14 Pages: 5

Assignors

ELECTROCHEMICALS INC.

Executed: 2008-12-31

OMG FIDELITY, INC.

Executed: 2008-12-31

Assignee

OMG ELECTRONIC CHEMICALS, INC.

400 CORPORATE SQUARE, SOUTH PLAINFIELD, NJ, 07080, UNITED STATES

Covered Properties (9)

Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates

Application: 11/165,097 →

Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates

Application: 10/782,177 →

Additives to Stop Copper Attack by Alkaline Etching Agents Such as Ammonia and Monoethanol Amine (Mea)

Application: 10/735,424 →

Printed Wiring Boards and Methods for Making Them

Application: 10/728,423 →

Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates

Application: 10/143,389 →

Methods of Avoiding Blowhole Formation by Conditioning Through Holes and Glass

Application: 10/087,051 →

Method for Roughening Copper Surfaces for Bonding to Substrates

Application: 10/028,955 →

Printed Wiring Boards and Methods for Making Them

Application: 09/954,486 →

Method to Improve the Stability of Dispersions of Carbon

Application: 09/915,444 →