Patent Assignment
Reel/Frame 022114/0177
Assignment of Assignor's Interest
Recorded: 2009-01-15
Pages: 3
Assignor
LUAN, JING-EN
Executed: 2008-12-20
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE LTD.
28 ANG MO KIO, INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Manufacturing Method of Chip Package with Coplanarity Controlling Feature
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.