Patent Assignment
Reel/Frame 022137/0021
Release of Security Interest
Recorded: 2009-01-20
Received: 2009-01-20
Pages: 3
Assignor
SQUARE 1 BANK
Executed: 2006-12-29
Assignee
IRVINE SENSORS CORPORATION
3001 REDHILL AVE., BUILDING 4, SUITE 108, COSTA MESA, CA, 92626, UNITED STATES
Covered Properties
(5)
Method for Electrical Interconnection of Angularly Disposed Conductive Patterns
Application:
10/726,888 →
Method for Creating Neo-Wafers from Singulated Integrated Circuit Die and a Device Made According to the Method
Application:
10/701,783 →
Stack of Multilayer Modules with Heat-Focussing Metal Layer
Application:
09/949,024 →
Retro-Reflector Warm Stop for Uncooled Thermal Imaging Cameras and Method of Using the Same
Application:
09/921,525 →
Method and Apparatus for Temperature Compensation of an Uncooled Focal Plane Array
Application:
09/853,819 →