Patent Assignment
Reel/Frame 022155/0938
Assignment of Assignor's Interest
Recorded: 2009-01-26
Pages: 4
Assignors
GUMMALLA, AJAY
Executed: 2009-01-19
ACHOUR, MAHA
Executed: 2009-01-19
LOPEZ, NORBERTO
Executed: 2009-01-19
THORNWALL, SHANE
Executed: 2009-01-19
NGUYEN, NHAN DUC
Executed: 2009-01-19
POILASNE, GREGORY
Executed: 2009-01-19
Assignee
RAYSPAN CORPORATION
11975 EL CAMINO REAL, SUITE 301, SAN DIEGO, CALIFORNIA, 92130
Covered Property
(1)
Metamaterial Structures with Multilayer Metallization and Via
Application:
12/270,410 →
Publication:
US 2009/0135087
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 8, 2011
From: RAYSPAN CORPORATION
To: TYCO ELECTRONIC SERVICES GMBH
Reel/Frame 025960/0676 →
Corrective Assignment to Correct the Name of the Receiving Party, Previously Recorded at Reel 025960 and Frames 0676-0682.
Apr 27, 2011
From: RAYSPAN CORPORATION
To: TYCO ELECTRONICS SERVICES GMBH
Reel/Frame 026200/0107 →