IP Library Assignment 022170/0039
Patent Assignment
Reel/Frame 022170/0039

Assignment of Assignor's Interest

Recorded: 2009-01-28 Pages: 9
Assignors
SAMOILOV, ARKADII V.
Executed: 2009-01-28
BERGEMONT, ALBERT
Executed: 2009-01-28
LO, CHIUNG-C.
Executed: 2009-01-28
HOLENARSIPUR, PRASHANTH
Executed: 2009-01-22
LONG, JAMES PATRICK
Executed: 2009-01-28
Assignee
MAXIM INTEGRATED PRODUCTS, INC.
120 SAN GABRIEL DRIVE, SUNNYVALE, CALIFORNIA, 94086
Covered Property (1)
Light Sensor Using Wafer-Level Packaging
Patent: 8,405,115 →
Application: 12/361,426 →
Publication: US 2010/0187557