IP Library › Assignment 022189/0750
Patent Assignment
Reel/Frame 022189/0750

Assignment of Assignor's Interest

Recorded: 2009-02-02 Pages: 3
Assignor
STMICROELECTRONICS, INC.
Executed: 2009-01-27
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)
5A SERAGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Step Cavity for Enhanced Drop Test Performance in Ball Grid Array Package
Patent: 7,956,475 →
Application: 12/336,273 →
Publication: US 2010/0148363
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 16, 2008
From: GOH, KIM-YONG; LUAN, JING-EN
To: STMICROELECTRONICS, INC.
Reel/Frame 021989/0507 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →