Patent Assignment
Reel/Frame 022193/0667
Assignment of Assignor's Interest
Recorded: 2009-02-03
Pages: 3
Assignor
TANAKA, HIRONORI
Executed: 2009-01-16
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU-KEN, 503-8604, JAPAN
Covered Property
(1)
Method for Manufacturing a Multilayer Printed Wiring Board for Providing an Electronic Component Therein