Patent Assignment
Reel/Frame 022194/0989
Assignment of Assignor's Interest
Recorded: 2009-01-27
Pages: 3
Assignor
INTEL CORPORATION
Executed: 2008-07-14
Assignee
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW (IMEC)
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method of Reducing the Interfacial Oxide Thickness
Application:
11/735,926 →
Publication:
US 2008/0254605
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.