Patent Assignment
Reel/Frame 022226/0115
Assignment of Assignor's Interest
Recorded: 2009-02-09
Pages: 5
Assignees
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW (IMEC)
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TSMC)
8, LI-HSIN ROAD 6, HSIN-CHU, 300-077, TAIWAN
Covered Property
(1)
Integrated Circuit and Manufacturing Method of Copper Germanide and Copper Silicide as Copper Capping Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.