Patent Assignment
Reel/Frame 022264/0797
Assignment of Assignor's Interest
Recorded: 2009-02-17
Pages: 6
Assignors
SKEETE, OSWALD
Executed: 2008-06-21
MAHAJAN, RAVI
Executed: 2008-06-23
GUZEK, JOHN
Executed: 2008-06-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, M/S SC4-202, SANTA CLARA, CALIFORNIA, 95052-5326
Covered Property
(1)
Integrated Circuit Packages Including High Density Bump-Less Build Up Layers and a Lesser Density Core or Coreless Substrate