Patent Assignment
Reel/Frame 022266/0047
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2009-02-17
Received: 2009-02-17
Pages: 8
Assignor
NXP B.V.
Executed: 2009-02-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TWX, 300-77, TAIWAN
Covered Applications
(18)
INTEGRATED CIRCUIT NANOTUBE-BASED SUBSRATE
App. No. 11/718,710
→
NANOTUBE-BASED DIRECTIONALLY-CONDUCTIVE ADHESIVE
App. No. 11/718,713
→
CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS
App. No. 11/718,711
→
ELECTRICALLY ENHANCED WIREBOND PACKAGE
App. No. 12/294,211
→
WARPAGE PREVENTING SUBSTRATES
App. No. 11/917,613
→
ENHANCED SUBSTRATE USING METAMATERIALS
App. No. 12/097,128
→
CARBON NANOTUBE BOND PAD STRUCTURE AND METHOD THEREFOR
App. No. 11/910,046
→
IP DATAGRAM DE-ENCAPSULATION
App. No. 11/814,280
→
CUT-OUT HEAT SLUG FOR INTEGRATED CIRCUIT DEVICE PACKAGING
App. No. 11/579,890
→
ELECTRONIC DEVICE AND CARRIER SUBSTRATE
App. No. 10/574,881
→
ELECTRONIC DEVICE AND CARRIER SUBSTRATE FOR SAME
App. No. 10/574,882
→
GROUND ARCH FOR WIREBOND BALL GRID ARRAYS
App. No. 10/565,044
→
SEMICONDUCTOR DEVICE AND METHOD OF ENVELOPING AN INTERGRATED CIRCUIT
App. No. 10/496,341
→
THERMAL-CONDUCTIVE SUBSTRATE PACKAGE
App. No. 10/279,703
→
INTEGRATED CIRCUIT PACKAGE INCLUDING SEALED GAPS AND PREVENTION OF VAPOR INDUCED FAILURES AND METHOD OF MANUFACTURING THE SAME
App. No. 10/261,893
→
METHOD OF MAKING A SURFACE MOUNTABLE SEMICONDUCTOR DEVICE USING A FLEXIBLE FOIL AND SEMICONDUCTOR DEVICE OBTAINED BY MEANS OF SAID METHOD
App. No. 10/067,425
→
SINGLE PACKAGE CONTAINING MULTIPLE INTEGRATED CIRCUIT DEVICES
App. No. 10/024,936
→
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
App. No. 09/851,444
→