Patent Assignment
Reel/Frame 022269/0733
Assignment of Assignor's Interest
Recorded: 2009-02-17
Pages: 5
Assignors
BLUCK, TERRY
Executed: 2009-02-04
SAHIBUDEEN, HIZAM
Executed: 2009-02-04
GRIMARD, DENNIS
Executed: 2009-02-17
Assignee
INTEVAC, INC.
3560 BASSETT STREET, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method for Optimized Removal of Wafer from Electrostatic Chuck