Patent Assignment
Reel/Frame 022271/0670
Assignment of Assignor's Interest
Recorded: 2009-02-18
Pages: 2
Assignor
YAMADA, SHIGERU
Executed: 2009-01-24
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Semiconductor Device, Camera Module, and Semiconductor Device Manufacturing Method
Application:
12/372,770 →
Publication:
US 2009/0224350