Patent Assignment
Reel/Frame 022273/0600
Assignment of Assignor's Interest
Recorded: 2009-02-18
Pages: 2
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Wiring Substrate for Use in Semiconductor Apparatus, Method for Fabricating the Same, and Semiconductor Apparatus Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.