Patent Assignment
Reel/Frame 022273/0640
Assignment of Assignor's Interest
Recorded: 2009-02-18
Received: 2009-02-18
Pages: 3
Assignor
PREISSER, ROBERT F.
Executed: 2009-02-17
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, DEX, 10553, GERMANY
Covered Properties
(2)
Prioritization of Recipient Email Messages
Application:
12/372,846 →
Process for Electrodeposition of Copper Chip to Chip, Chip to Wafer and Wafer to Wafer Interconnects in Through-Silicon Vias (Tsv)
Application:
12/372,113 →