Assignment of Assignor's Interest

Recorded: 2009-03-03 Pages: 3

Assignors

YANBE, SHINYA

Executed: 2009-02-13

MARUYAMA, KAZUO

Executed: 2009-02-13

IKEDA, TAKASHI

Executed: 2009-02-13

MIYAMOTO, TETSU

Executed: 2009-02-20

Assignees

KEIHIN CORPORATION

26-2, NISHISHINJUKU 1-CHOME, SHINJUKU-KU, TOKYO, JAPAN

HONDA MOTOR CO., LTD.

1-1, MINAMI-AOYAMA 2-CHOME, MINATO-KU, TOKYO, 107-8556, JAPAN

Covered Property (1)

Heat Dissipation Structure of a Print Circuit Board

Patent: 8,039,752 →

Application: 12/390,022 →

Publication: US 2009/0211788

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.