Patent Assignment
Reel/Frame 022343/0821
Security Agreement
Recorded: 2009-03-05
Received: 2009-03-05
Pages: 11
Assignor
PULSE ENGINEERING, INC.
Executed: 2009-03-04
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
270 PARK AVENUE, NEW YORK, NY, 10017, UNITED STATES
Covered Properties
(26)
Universal Connector Assembly and Method of Manufacturing
Application:
11/827,074 →
Universal Connector Assembly and Method of Manufacturing
Application:
11/170,583 →
Precision Inductive Devices and Methods
Application:
10/990,915 →
Impedance Blocking Filter Circuit
Application:
10/748,729 →
Controlled Inductance Device and Method
Application:
10/666,580 →
Shielded Connector Assembly and Method of Manufacturing
Application:
10/417,743 →
Controlled Inductance Device and Method
Application:
10/381,062 →
Electronics Component Assembly
Application:
29/177,597 →
Electronics Component Package
Application:
29/177,596 →
Shielded Microelectronic Connector Assembly and Method of Manufacturing
Application:
10/371,059 →
Impedance Blocking Filter Circuit
Application:
10/355,897 →
Electronic Packaging Device and Method
Application:
10/263,900 →
Advanced Microelectronic Connector Assembly and Method of Manufacturing
Application:
10/246,840 →
Method of Manufacturing Electronic Packaging Device with Insertable Leads
Application:
10/242,066 →
Connector with Insert Assembly and Method of Manufacturing
Application:
10/139,907 →
Advanced Microelectronic Connector Assembly and Method of Manufacturing
Application:
10/099,645 →
Advanced Electronic Signal Conditioning Assembly and Method
Application:
10/096,605 →
Alarm Filter Circuit
Application:
10/013,218 →
Controlled Induction Device and Method of Manufacturing
Application:
10/000,877 →
Telecommunications Gateway and Method
Application:
09/975,142 →
Electronic Packaging Device
Application:
09/947,176 →
Electronics Housing Elements
Application:
29/141,570 →
Alarm Filter Circuit
Application:
09/848,654 →
Method of Manufacturing an Improved Microelectronic Package
Application:
09/794,263 →
Electronic Packaging Device with Insertable Leads and Method of Manufacturing
Application:
09/773,134 →
Connector Assembly with Side-by-Side Terminal Arrays
Application:
09/757,112 →