IP Library › Assignment 022396/0259
Patent Assignment
Reel/Frame 022396/0259

Assignment of Assignor's Interest

Recorded: 2009-03-16 Pages: 10
Assignors
LEE, JIN-YUAN
Executed: 2001-01-28
LIN, MOU-SHIUNG
Executed: 2001-01-28
HUANG, CHING-CHENG
Executed: 2001-01-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property (1)
Low fabrication cost, fine pitch and high reliability solder bump
Application: 12/098,468 →
Publication: US 2008/0258305
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →