IP Library Assignment 022396/0283
Patent Assignment
Reel/Frame 022396/0283

Assignment of Assignor's Interest

Recorded: 2009-03-16 Received: 2009-03-16 Pages: 10
Assignors
HUANG, CHING-CHENG
Executed: 2001-01-28
LEE, JIN-YUAN
Executed: 2001-01-28
LIN, MOU-SHIUNG
Executed: 2001-01-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, TWX, 300, TAIWAN
Covered Property (1)
Low fabrication cost, fine pitch and high reliability solder bump
Application: 12/098,469 →