Patent Assignment
Reel/Frame 022409/0365
Assignment of Assignor's Interest
Recorded: 2009-03-17
Pages: 5
Assignors
KIM, WOON-CHUN
Executed: 2009-02-23
YIM, SOON-GYU
Executed: 2009-02-23
KWEON, YOUNG-DO
Executed: 2009-02-23
LEE, JAE-KWANG
Executed: 2009-02-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with a Metal Post