Assignment of Assignor's Interest

Recorded: 2009-03-24 Received: 2009-03-24 Pages: 6

Assignors

CHOW, SENG GUAN

Executed: 2009-03-18

HUANG, RUI

Executed: 2009-03-18

KUAN, HEAP HOE

Executed: 2009-03-18

LIN, YAOJIAN

Executed: 2009-03-20

Assignee

STATS CHIPPAC, LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE

Covered Property (1)

Semiconductor Device and Method of Forming No-Flow Underfill Material Around Vertical Interconnect Structure

Application: 12/410,312 →