Patent Assignment
Reel/Frame 022474/0170
Assignment of Assignor's Interest
Recorded: 2009-03-30
Pages: 7
Assignors
CHO, HAG-JU
Executed: 2009-03-10
VELOSO, ANABELA
Executed: 2009-02-23
YU, HONGYU
Executed: 2009-03-03
KUBICEK, STEFAN
Executed: 2009-02-23
CHANG, SHOU-ZEN
Executed: 2009-02-23
Assignees
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW (IMEC)
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 442-743, KOREA, REPUBLIC OF
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TSMC)
8, LI-HSIN ROAD 6, HSINCHU, 300-077, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.