IP Library › Assignment 022497/0293
Patent Assignment
Reel/Frame 022497/0293

Assignment of Assignor's Interest

Recorded: 2009-04-02 Pages: 4
Assignors
MORI, KENTARO
Executed: 2009-03-31
YAMAMICHI, SHINTARO
Executed: 2009-03-31
KIKUCHI, KATSUMI
Executed: 2009-03-31
MURAI, HIDEYA
Executed: 2009-03-31
FUNAYA, TAKUO
Executed: 2009-03-31
MAEDA, TAKEHIKO
Executed: 2009-03-31
HONDA, HIROKAZU
Executed: 2009-03-31
OGAWA, KENTA
Executed: 2009-03-31
TSUKANO, JUN
Executed: 2009-03-31
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 108-8001, JAPAN
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Wiring Board Composite Body, Semiconductor Device, and Method for Manufacturing the Wiring Board Composite Body and the Semiconductor Device
Application: 12/439,933 →
Publication: US 2010/0232127
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025193/0174 →
Assignment of Assignor's Interest Jul 9, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030754/0778 →