IP Library Assignment 022505/0286
Patent Assignment
Reel/Frame 022505/0286

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2009-04-04 Received: 2009-04-04 Pages: 5
Assignors
KIM, YOUNGCHUL
Executed: 2009-03-27
KO, CHAN HOON
Executed: 2009-03-27
PARK, SOO-SAN
Executed: 2009-03-27
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF
App. No. 12/413,302