Patent Assignment
Reel/Frame 022511/0012
Assignment of Assignor's Interest
Recorded: 2009-04-06
Pages: 4
Assignors
CHANG, HUNG-PIN
Executed: 2008-12-01
HSU, KUO-CHING
Executed: 2008-12-01
CHEN, CHEN-SHIEN
Executed: 2008-12-01
CHIOU, WEN-CHIH
Executed: 2008-12-01
YU, CHEN-HUA
Executed: 2008-12-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Bump Structure having Tapered Sidewalls for Stacked Dies