Patent Assignment
Reel/Frame 022524/0119
Assignment of Assignor's Interest
Recorded: 2009-04-09
Pages: 3
Assignors
TSAI, YAO-JUN
Executed: 2008-11-14
SHEU, JINN-KONG
Executed: 2008-11-07
YEN, HSI-HSUAN
Executed: 2008-11-19
HU, HUNG-LIEH
Executed: 2008-11-11
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Light Emitting Diode, Package Structure and Manufacturing Method Thereof