Patent Assignment
Reel/Frame 022542/0975
Bill of Sale
Recorded: 2009-04-15
Received: 2009-04-15
Pages: 13
Assignors
XSIL CORPORATION, LTD.
Executed: 2009-01-29
XSIL INTERNATIONAL, LTD.
Executed: 2009-01-29
XSIL TECHNOLOGY, LTD.
Executed: 2009-01-29
XSIL, INC.
Executed: 2009-01-29
XSIL, LTD.
Executed: 2009-01-29
Assignee
ELECTRO SCIENTIFIC INDUSTRIES, INC.
13900 NW SCIENCE PARK DRIVE, PORTLAND, OR, 97229, UNITED STATES
Covered Properties
(11)
Increasing Die Strength by Etching During or After Dicing
Application:
11/666,796 →
Laser Machining Apparatus and Method with a Vacuum Extracting System and at Least a First Containement Zone for Containing Deposition of Emitted Hazardous Material
Application:
12/223,044 →
Die Bonding
Application:
10/561,883 →
Laser machining using a surfactant film
Application:
10/559,442 →
Laser machining using an active assist gas
Application:
10/548,284 →
Focusing an Optical Beam to Two Foci
Application:
10/559,026 →
Program-Controlled Dicing of a Substrate Using a Pulsed Laser
Application:
10/511,743 →
Methods and systems for laser machining a substrate
Application:
10/490,985 →
Laser Machining System and Method
Application:
10/102,702 →
Circuit Singulation System and Method
Application:
10/060,414 →
Control of Laser Machining
Application:
09/984,086 →