Patent Assignment
Reel/Frame 022563/0487
Assignment of Assignor's Interest
Recorded: 2009-04-17
Pages: 3
Assignor
TU, CHUAN-CHENG
Executed: 2009-04-06
Assignee
RGB CONSULTING CO., LTD.
NO. 23, GONGYING 5TH ST., SOUTH DIST., TAINAN CITY, 702, TAIWAN
Covered Property
(1)
Method for Bonding Semiconductor Structure with Substrate and High Efficiency Photonic Device Manufactured by Using the Same Method