Patent Assignment
Reel/Frame 022566/0873
Assignment of Assignor's Interest
Recorded: 2009-04-07
Pages: 3
Assignors
PARK, SANG-JOON
Executed: 2009-02-09
KIM, KYOUNG-KOOK
Executed: 2009-02-09
KIM, YU-SIK
Executed: 2009-02-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Structures and Wafer Bonding Methods