Patent Assignment
Reel/Frame 022567/0451
Assignment of Assignor's Interest
Recorded: 2009-04-20
Received: 2009-04-20
Pages: 18
Assignor
IRVINE SENSORS CORPORATION
Executed: 2009-03-16
Assignee
APROLASE DEVELOPMENT CO., LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DE, 19808, UNITED STATES
Covered Property
(1)
High density interconnect assembly comprising stacked electronic module
Application:
11/499,403 →