Patent Assignment
Reel/Frame 022570/0249
Assignment of Assignor's Interest
Recorded: 2009-03-17
Pages: 2
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property
(1)
Wire bonding method
Application:
12/284,536 →
Publication:
US 2010/0072262
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.