IP Library Assignment 022612/0524
Patent Assignment
Reel/Frame 022612/0524

Assignment of Assignor's Interest

Recorded: 2009-04-29 Pages: 2
Assignor
DANNO, TADATOSHI
Executed: 2009-03-25
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device Having Lands Disposed Inward and Outward of an Area of a Wiring Board Where Electrodes Are Disposed
Patent: 7,919,858 →
Application: 12/432,057 →
Publication: US 2009/0309210
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →